Tao Yuan, Ph.D.

Associate Professor

Department of Industrial and Systems Engineering

Ohio University



Office: 279 Stocker Center, Athens, Ohio 45701, USA

Phone: 740 593 1547     

Email: yuan@ohio.edu



Dr. Tao Yuan joined the Industrial and Systems Engineering Department at Ohio University in 2008. His research interests are mainly in quality and reliability issues related to nanoelectronics and advanced engineering materials, applied statistics and stochastic processes, and Bayesian statistics.



University of Tennessee, Knoxville, Industrial Engineering, Ph.D., 2007

Texas A&M University, College Station, Industrial Engineering, M.E., 2004

Texas A&M University, College Station, Aerospace Engineering, M.S., 2003

Tsinghua University, Beijing, China, Thermal Engineering, B.E., 2000


Working Experience

08/2014 – present      Associate Professor

                                  Department of Industrial and Systems Engineering, Ohio University, USA

09/2008 – 08/2014    Assistant Professor

                                  Department of Industrial and Systems Engineering, Ohio University, USA

01/2008 – 07/2008    Postdoctoral Research Associate

                                  Department of Industrial and Information Engineering,

                                  University of Tennessee, Knoxville, USA


Refereed Journal Publication

[1]        T. Yuan and J. Yi, “A Hierarchical Bayesian Degradation Model for Heterogeneous Data,” IEEE Transactions on Reliability, vol. 64, no. 1, pp. 63-70, 2015.

[2]        S.J. Bae, T. Yuan, S. Ning, and W. Kuo, “A Bayesian Approach to Modeling Two-phase Degradation using Change-point Regression,” Reliability Engineering & System Safety, vol. 124, pp. 66-74, 2015.

[3]        Z. Tang, T. Yuan, C.-W. Tsai, J.-W. Yeh, C.D. Lundin, and P.K. Liaw, “Fatigue Behavior of a wrought Al0.5CoCrCuFeNi Two-Phase High-Entropy Alloy,” Acta Materialia, vol. 99, pp. 247-258, 2015.

[4]        S.-J. Kim, T. Yuan, and S.J. Bae, “A Spatio-Temporal Defect Process Model for Competing Progressive Breakdown Modes of Ultra-Thin Gate Oxides,” IEEE Transactions on Reliability, in press, 2015.

[5]        T. Yuan, X. Liu, S.Z. Ramadan, and Y. Kuo, “Bayesian Analysis for Accelerated Life Tests using a Dirichlet Process Weibull Mixture Model,” IEEE Transactions on Reliability, vol. 63, no. 1, pp. 58-67, 2014.

[6]        N. Cheng and T. Yuan, “Nonparametric Bayesian Lifetime Data Analysis using Dirichlet Process Lognormal Mixture Model,” Naval Research Logistics, vol. 60, no. 3, pp. 208-221, 2013.

[7]        C.-P. Chuang, T. Yuan, W. Dmowski, G.-Y. Wang, M. Freels, P.K. Liaw, R. Li, and T. Zhang, “Fatigue-induced Damage in Zr-based Bulk Metallic Glasses,” Scientific Reports, vol. 3, article no. 2578, 2013.

[8]        T. Yuan, G. Wang, Q. Feng, P.K. Liaw, Y. Yokoyama, and A. Inoue, “Modeling Size Effects on Fatigue Life of a Zirconium-based Bulk-Metallic Glass under Bending,” Acta Materialia, vol. 61, pp. 273-279, 2013.

[9]        T. Yuan and X. Zhu, “Reliability Study for Ultra-thin Gate Dielectric Films with Variable Thickness Levels,” IIE Transactions, vol. 44, pp. 744-753, 2012.

[10]    C.-H. Yang, T. Yuan, W. Kuo, and Y. Kuo, “Nonparametric Bayesian Modeling of Hazard Rate with a Change-point for Nanoelectronic Devices,” IIE Transactions, vol. 44, pp. 496-506, 2012.

[11]    T. Yuan, X. Liu, and W. Kuo, “Planning Simple Step-stress Accelerated Life Tests using Bayesian Methods,” IEEE Transactions on Reliability, vol. 61, no. 1, pp. 254-263, 2012.

[12]    M.A. Hemphill, T. Yuan, G.Y. Wang, J.W. Yeh, C.W. Tsai, A. Chuang, and P.K. Liaw, “Fatigue Behavior of Al0.5CoCrCuFeNi High-Entropy Alloys,” Acta Materialia, vol. 60, pp. 5723-5734, 2012.

[13]    X. Liu, C.-H. Yang, Y. Kuo, and T. Yuan, “Memory Functions of Molybdenum Oxide Nanodots-Embedded ZrHfO High-k,” Electrochemical and Solid-State Letters, vol. 15, pp. H192-H194, 2012.

[14]    T. Yuan, S. Ramadan, and S.-J. Bae, “Yield Prediction for Integrated Circuits Manufacturing through Hierarchical Bayesian Modeling of Spatial Defects,” IEEE Transactions on Reliability, vol. 60, no. 4, pp. 729-741, 2011.

[15]    T. Yuan, W. Kuo, and S.-J. Bae, “Detection of Spatial Defect Patterns Generated in Semiconductor Fabrication Processes,” IEEE Transactions on Semiconductor Manufacturing, vol. 24, pp. 392-403, 2011.

[16]    T. Yuan and Y. Kuo, “Bayesian Analysis of Hazard Rate, Change Point, and Cost-optimal Burn-in Time for Electronic Devices,” IEEE Transactions on Reliability, vol. 59, no. 1, pp. 132-138, 2010.

[17]    T. Yuan, S.-J. Bae, and J.-I. Park, “Bayesian Spatial Defect Pattern Recognition in Semiconductor Fabrication using Support Vector Clustering,” International Journal of Advanced Manufacturing Technology, vol. 51, pp. 671-683, 2010.

[18]    T. Yuan and W. Kuo, “A Model-based Clustering Approach to the Recognition of Spatial Defect Patterns Produced during Semiconductor Fabrication,” IIE Transactions, vol. 40, no. 2, pp. 93-101, 2008.

[19]    T. Yuan and W. Kuo, “Spatial Defect Pattern Recognition for Semiconductor Manufacturing using Model-based Clustering and Bayesian Inference,” European Journal of Operational Research, vol. 190, pp. 228-240, 2008.

[20]    W. Luo, T. Yuan, Y. Kuo, J. Lu, J. Yan, and W. Kuo, “Breakdown Phenomena of Zirconium-doped Hafnium Oxide High-k Stack with Inserted Interface Layer,” Applied Physics Letters, vol. 89, article no. 072901, 2006.

[21]    W. Luo, T. Yuan, Y. Kuo, J. Lu, J. Yan, and W. Kuo, “Charge Trapping and Dielectric Relaxation in Connection with Breakdown of High-k Gate Dielectric Stacks,” Applied Physics Letters, vol. 88, article no. 202904, 2006.

[22]    T. Yuan, P.G. Cizmas, and T. O'Brien, “A Reduced-order Model for a Bubbling Fluidized Bed based on Proper Orthogonal Decomposition,” Computers and Chemical Engineering, vol. 30, pp. 243-259, 2005.


Professional Services

1.      Associate Editor for IEEE Transactions on Reliability

2.      Reviewer for Applied Mathematical Modeling, Communications in Statistics - Simulation and Computation, Computers and Industrial Engineering, Computers and Operations Research, Computers and Security, European Journal of Operational Research, IEEE Transactions on Components, Packaging, and Manufacturing Technology, IEEE Transactions on Automation Science and Engineering, IEEE Transactions on Reliability, IEEE Transactions on Semiconductor Manufacturing, IIE Transactions, Journal of Manufacturing Systems, Journal of Risk and Reliability, Journal of Robotics and Computer Integrated Manufacturing, Journal of Statistical Computation and Simulation


Professional Affiliations

1.      Institute for Operations Research and the Management Science (INFORMS)

2.      Institute of Industrial Engineers (IIE)

3.      Institute of Electrical and Electronics Engineers (IEEE)



·         Operations Research

·         Engineering Statistics

·         Engineering Probability

·         Design of Experiments

·         Stochastic Processes

·         Quality Systems