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Precision Diamond Saw
LECO VC-50

diamond sawThe LECO VC-50 Precision Diamond Saw is designed for precision sectioning of ceramics, metals, and electronic components. A 5 inch diameter by 0.015 inch thick diamond cutting blade is capable of cutting 1.5 inch cross-sections with minimal deformation and loss of material. The user specified blade speed is maintained at a constant RPM, even under varying load conditions, allowing for a uniform and precise cut.

  • Precision cutting of a variety of materials
  • Low deformation and material loss
  • 0-500 RPM variable speed
  • Blade speed remains constant at varying load conditions
  • For further information, please refer to www.leco.com

Center for Electrochemical Engineering Research
Russ College of Engineering and Technology
165 Stocker Center
Ohio University
Athens, OH 45701
Tel: (740) 593-9670
ceer@ohio.edu

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